Thermal Material Regular Silicone Thermal Pad
It can be adjustment for solving the product tolerance
issue. The high vertical heat conductivity could be good
TIM (Thermal Interface Material) between heat source (CPU or electronic chipset) and cooling module. We also can offer the liner, which can be adjusted to be easier handled.
Thermal Conductivity:1.0 W/m·k ~ 8.0W/m·k
Easy to apply and rework
All products can meet UL V-0 for flame-retardant
We can customize the special-shaped Thermal pad according to client’s drawing.
Computers, power modules, high-speed large storage drives,Flat panel display, network communication equipment, power,Conversion equipment,LCD backlight module and so on.